3D electronic architectures offer unique capabilities that are inaccessible to planar electronics because of their out‑of‑plane geometries and omnidirectional interfaces. Mechanically guided buckling assembly enables programmable 3D architectures in diverse, high‑performance materials, yet the elastomer substrate that drives this transformation remains attached, limiting system-level integration and deployment in certain application scenarios. Here, the study presents a film-assisted shape-locking assembly strategy that replaces the elastomer substrate with flexible thin films or flexible printed-circuit boards to lock post-buckled 3D structures while providing a platform for direct electrical interconnection.
